Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications

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Signal Processing, Telecommunication & Embedded Systems: AI and ML ApplicationsThis book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and

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Heavy-duty plastic holder and built-in fold-out legs provide support if not mounted